Computational Models for Microvia Fill Process Control
نویسندگان
چکیده
OF DOCTORAL DISSERTATION AALTO UNIVERSITY SCHOOL OF SCIENCE AND TECHNOLOGY P. O. BOX 11000, FI-00076 AALTO http://www.aalto.fi Author Antti Pohjoranta Name of the dissertation Manuscript submitted October 26, 2009 Manuscript revised February 3, 2010 Date of the defence March 19, 2010 Article dissertation (summary + original articles) Monograph Faculty Department Field of research Opponent(s) Supervisor Instructor Abstract
منابع مشابه
Microvia Fill Process Boundary Control
This paper presents an exponentially stabilizing boundary control for the microvia fill process. The control accounts for the mass balance of the copper ions in the electrolyte and for the surface mass balance of the deposition-blocking additives, both modeled with a diffusion mass transfer model in a shape changing domain. With simulations based on real-world data, it is shown that by applying...
متن کاملPublication P1 A. Pohjoranta and R. Tenno. 2007. A method for microvia-fill process modeling
متن کامل
Exact Controls for the Superconformal via Fill Process
This paper reports a means for stabilizing the microvia ll ratio on a desired level, using the total plating time and the system galvanostat setpoint current density as optimal controls. Both control variables are solved as functions of the process state as well as selected manufacturer preference variables that are typical for the via ll technology applied in multilayered printed circuit board...
متن کاملSimulation of the Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
The advancement of area-array packages, such as flip chips and chip scale packages, has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a smaller footprint area. HDI substrates and printed circuit boards use microvias as interconnects between conductor layers. HDIs have evolved from single-level microvias to stacked microvias that travers...
متن کامل