Computational Models for Microvia Fill Process Control

Microvia Fill Process Boundary Control

This paper presents an exponentially stabilizing boundary control for the microvia fill process. The control accounts for the mass balance of the copper ions in the electrolyte and for the surface mass balance of the deposition-blocking additives, both modeled with a diffusion mass transfer model in a shape changing domain. With simulations based on real-world data, it is shown that by applying...

An ALE Model for Prediction and Control of the Microvia Fill Process with Two Additives

Publication P1 A. Pohjoranta and R. Tenno. 2007. A method for microvia-fill process modeling

Exact Controls for the Superconformal via Fill Process

This paper reports a means for stabilizing the microvia ll ratio on a desired level, using the total plating time and the system galvanostat setpoint current density as optimal controls. Both control variables are solved as functions of the process state as well as selected manufacturer preference variables that are typical for the via ll technology applied in multilayered printed circuit board...

Simulation of the Influence of Manufacturing Quality on Thermomechanical Stress of Microvias

The advancement of area-array packages, such as flip chips and chip scale packages, has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a smaller footprint area. HDI substrates and printed circuit boards use microvias as interconnects between conductor layers. HDIs have evolved from single-level microvias to stacked microvias that travers...